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Electronics Enclosure

Injection Molding. Snapfits. Master Modeling.

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Overview

Key Challenges

U-shape Snap Design

Design for Injection Molding

1 Week Time Constraint 

Skills Applied

Master Modeling (SolidWorks)

Injection Molding

Snapfit Design

Electronics Packaging

3D Printing

My Role

Mechanical Engineer - Team of 1

Synapse Product Development

San Francisco, CA

Year

June 2020

About

The purpose of this exercise was to learn the process of designing packaging for electronics. This enclosure was designed using a master modeling approach, incorporates a snapfit design, and can be injection molded. It houses a raspberry pi, LiPo battery and connectors. 

System Overview

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Requirements

1. Must house a PCB, battery, USB connector

2. Must be possible to injection mold the box and lid

3. Must incorporate a snapfit joint connecting lid to box

4. Must design components using a master modeling approach on SolidWorks

Component Selection

Option 1: RPi 4, Power Bank, USB C, Micro USB connectors

Powerbank_schematic.png

Side View

Front View

Powerbank_key.png

Option 2: RPi 4, LiPo battery, LiPo Shim, USB connector

Shim_schematic.png

Side View

Front View

Shim_key.png

Option 3: RPi 4, Li-ion battery, Battery hat, USB connectors

Hat_schematic.png

Side View

Front View

hat_key.png

Decision: Lipo Battery is the most appropriate power source for this application. It will also be accessible if it needs to be replaced.

Matrix_components.PNG

Snapfit Design

Selecting Type of Snap

snaps_types.PNG

Separable vs Inseparable

snaps_separation.PNG

Decision: Designing a U-shape snap will teach me the fundamentals of snapfit design with an interesting challenge. It is appropriate for this application and will be easy for a user to assemble and disassemble.

Matrix_snap.PNG

Lid to Box Interface

Cross Section

Top View

interface_tabs.PNG

U-Shape snap and tabs or cantilever snap

interface_2U.PNG
interface_2U.PNG

U-Shape snap on both sides of lid

interface_finaltabs.PNG

Decision: Including two small tabs on the lid and two slots in the side of the box wall will make it easy for a user to locate the lid and secure it in place. It will also give me practice designing two different interfaces (snap and tabs).

Matrix_interface.PNG

Benchmark Design

I used the battery door of a TV Remote to get an idea of thicknesses, size ratios, and gaps. I used the dimensions as a reference for a CAD model and made iterations as needed.

benchmark sketch.PNG

Gaps, Thicknesses, Tolerances

tolerancing.PNG

Version 1 Dimensions

  • Box Wall Thickness: 2.0mm - 2.5mm

  • Snap Thickness: 1.5mm

3D Printing Tolerance Reference

  • 0mm - Press fit

  • 0.1mm - Line to line

  • 0.2mm - Will slide freely

  • 0.3mm - Will rattle

I planned to 3D print 3 lids with varying snap engagements and gaps to test out the difference. This exercise would help me understand how slight changes in dimensions can make an impact on a 3D printed part.

Injection Molding

Concept Sketching

IM_sketch.PNG

Top View

Bosses

  • PCB can be screwed to box using screw bosses

  • M2.5 Screws

  • Either use threaded inserts or tap holes

Ribs

  • Ribs can be connected to side wall to support bosses 

  • Can be used to prevent battery from shifting

  • May use adhesive for battery as well

Boss_reference.PNG
boss_sketch.PNG
Rib_reference.PNG
rib_sketch.PNG

Tooling and Parting Lines

To make the parts possible to injection mold, I had to think about what the tooling would look like and where the parting lines would be. I sketched a cross section of the lid and enclosure and drew the core and cavity. I made sure to consider how the undercuts would be formed using lifters or slides.

I ran a draft analysis in SolidWorks using parting lines as a reference. This helped me see which walls needed drafting. The green indicates that the draft was added.

Master Modeling

Approach

MM approach.PNG

Master modeling was not an essential method for designing this enclosure. I used it solely for the purpose of learning. The diagram above shows an approach that two people could take if they were working on different components (electronics and lid).

Top Master

Sub Master: Electronics